Copper Electrodeposition for Nanofabrication of Electronics Devices (Record no. 92330)

000 -LEADER
fixed length control field 02804nam a22005175i 4500
001 - CONTROL NUMBER
control field 978-1-4614-9176-7
003 - CONTROL NUMBER IDENTIFIER
control field DE-He213
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20140220082504.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 131120s2014 xxu| s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781461491767
-- 978-1-4614-9176-7
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/978-1-4614-9176-7
Source of number or code doi
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number QD551-578
072 #7 - SUBJECT CATEGORY CODE
Subject category code PNRH
Source bicssc
072 #7 - SUBJECT CATEGORY CODE
Subject category code SCI013050
Source bisacsh
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 541.37
Edition number 23
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Kondo, Kazuo.
Relator term editor.
245 10 - TITLE STATEMENT
Title Copper Electrodeposition for Nanofabrication of Electronics Devices
Medium [electronic resource] /
Statement of responsibility, etc edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi.
264 #1 -
-- New York, NY :
-- Springer New York :
-- Imprint: Springer,
-- 2014.
300 ## - PHYSICAL DESCRIPTION
Extent VIII, 282 p. 190 illus., 75 illus. in color.
Other physical details online resource.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
-- c
-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
490 1# - SERIES STATEMENT
Series statement Nanostructure Science and Technology,
International Standard Serial Number 1571-5744
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating.
520 ## - SUMMARY, ETC.
Summary, etc This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Chemistry.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronics.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Nanotechnology.
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Chemistry.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electrochemistry.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Nanotechnology.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronics and Microelectronics, Instrumentation.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Solid State Physics.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Akolkar, Rohan N.
Relator term editor.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Barkey, Dale P.
Relator term editor.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Yokoi, Masayuki.
Relator term editor.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Display text Printed edition:
International Standard Book Number 9781461491750
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title Nanostructure Science and Technology,
-- 1571-5744
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://dx.doi.org/10.1007/978-1-4614-9176-7
912 ## -
-- ZDB-2-CMS

No items available.

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