Kondo, Kazuo.
Copper Electrodeposition for Nanofabrication of Electronics Devices [electronic resource] / edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi. - VIII, 282 p. 190 illus., 75 illus. in color. online resource. - Nanostructure Science and Technology, 1571-5744 . - Nanostructure Science and Technology, .
Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating.
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners.
9781461491767
10.1007/978-1-4614-9176-7 doi
Chemistry.
Electronics.
Nanotechnology.
Chemistry.
Electrochemistry.
Nanotechnology.
Electronics and Microelectronics, Instrumentation.
Solid State Physics.
QD551-578
541.37
Copper Electrodeposition for Nanofabrication of Electronics Devices [electronic resource] / edited by Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi. - VIII, 282 p. 190 illus., 75 illus. in color. online resource. - Nanostructure Science and Technology, 1571-5744 . - Nanostructure Science and Technology, .
Copper Electrodeposition -- Suppression Effect and Additive Chemistry -- Acceleration Effect -- Modeling and Simulation -- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects -- Microstructure of Evolution of Copper in Nano-scale Interconnect Features -- Direct Copper Plating -- Through Silicon Via -- Build-up Printed Wiring Boards -- Copper Foil Smooth on Both Sides for Lithium Ion Battery -- Through Hole Plating.
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners.
9781461491767
10.1007/978-1-4614-9176-7 doi
Chemistry.
Electronics.
Nanotechnology.
Chemistry.
Electrochemistry.
Nanotechnology.
Electronics and Microelectronics, Instrumentation.
Solid State Physics.
QD551-578
541.37