000 01291nam a22004215i 4500
001 978-1-4419-0076-0
003 DE-He213
005 20130515021012.0
007 cr nn 008mamaa
008 100301s2009 xxu| s |||| 0|eng d
020 _a9781441900760
_9978-1-4419-0076-0
024 7 _a10.1007/978-1-4419-0076-0
_2doi
050 4 _aTK7800-8360
050 4 _aTK7874-7874.9
072 7 _aTJF
_2bicssc
072 7 _aTEC008000
_2bisacsh
082 0 4 _a621.381
_223
100 1 _aGupta, Tapan.
245 1 0 _aCopper Interconnect Technology
_h[electronic resource] /
_cby Tapan Gupta.
260 _aNew York, NY :
_bSpringer US,
_c2009.
300 _bdigital.
650 0 _aEngineering.
650 0 _aElectronics.
650 0 _aSystems engineering.
650 0 _aOptical materials.
650 0 _aNanotechnology.
650 1 4 _aEngineering.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aOptical and Electronic Materials.
650 2 4 _aCircuits and Systems.
650 2 4 _aNanotechnology.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781441900753
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4419-0076-0
912 _aZDB-2-ENG
999 _c72554
_d72554