000			01507nam a22004575i 4500
001			978-0-387-95868-2
003			DE-He213
005			20130515020638.0
007			cr nn 008mamaa
008			100301s2009 xxu| s |||| 0|eng d
020			_a9780387958682 _9978-0-387-95868-2
024	7		_a10.1007/978-0-387-95868-2 _2doi
050		4	_aQD551-578
072		7	_aPNRH _2bicssc
072		7	_aSCI013050 _2bisacsh
082	0	4	_a541.37 _223
100	1		_aShacham-Diamand, Yosi.
245	1	0	_aAdvanced Nanoscale ULSI Interconnects: Fundamentals and Applications _h[electronic resource] / _cedited by Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba.
260			_aNew York, NY : _bSpringer New York, _c2009.
300			_bdigital.
650		0	_aChemistry.
650		0	_aChemical engineering.
650		0	_aComputer engineering.
650		0	_aMaterials.
650		0	_aNanotechnology.
650	1	4	_aChemistry.
650	2	4	_aElectrochemistry.
650	2	4	_aMaterials Science, general.
650	2	4	_aIndustrial Chemistry/Chemical Engineering.
650	2	4	_aElectrical Engineering.
650	2	4	_aNanotechnology.
700	1		_aOsaka, Tetsuya.
700	1		_aDatta, Madhav.
700	1		_aOhba, Takayuki.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387958675
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-387-95868-2
912			_aZDB-2-CMS
999			_c68662 _d68662