000			01372nam a22003975i 4500
001			978-0-387-76534-1
003			DE-He213
005			20130515020601.0
007			cr nn 008mamaa
008			100301s2008 xxu| s |||| 0|eng d
020			_a9780387765341 _9978-0-387-76534-1
024	7		_a10.1007/978-0-387-76534-1 _2doi
100	1		_aTan, Chuan Seng.
245	1	0	_aWafer Level 3-D ICs Process Technology _h[electronic resource] / _cedited by Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif.
260			_aBoston, MA : _bSpringer US, _c2008.
300			_bdigital.
490	0		_aIntegrated Circuits and Systems, _x1558-9412
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aOptical materials.
650		0	_aSurfaces (Physics).
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aSurfaces and Interfaces, Thin Films.
650	2	4	_aEngineering, general.
700	1		_aGutmann, Ronald J.
700	1		_aReif, L. Rafael.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387765327
830		0	_aIntegrated Circuits and Systems, _x1558-9412
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-387-76534-1
912			_aZDB-2-ENG
999			_c68067 _d68067