000 01327nam a22004215i 4500
001 978-0-387-33913-9
003 DE-He213
005 20130515020448.0
007 cr nn 008mamaa
008 100301s2007 xxu| s |||| 0|eng d
020 _a9780387339139
_9978-0-387-33913-9
024 7 _a10.1007/0-387-33913-2
_2doi
050 4 _aTK7800-8360
050 4 _aTK7874-7874.9
072 7 _aTJF
_2bicssc
072 7 _aTEC008000
_2bisacsh
082 0 4 _a621.381
_223
100 1 _aGreig, William J.
245 1 0 _aIntegrated Circuit Packaging, Assembly and Interconnections
_h[electronic resource] /
_cby William J. Greig.
260 _aBoston, MA :
_bSpringer US,
_c2007.
300 _bdigital.
650 0 _aEngineering.
650 0 _aEngineering design.
650 0 _aElectronics.
650 0 _aSystems engineering.
650 0 _aOptical materials.
650 1 4 _aEngineering.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aCircuits and Systems.
650 2 4 _aEngineering Design.
650 2 4 _aOptical and Electronic Materials.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9780387281537
856 4 0 _uhttp://dx.doi.org/10.1007/0-387-33913-2
912 _aZDB-2-ENG
999 _c66760
_d66760