000 03532nam a22005175i 4500
001 978-1-4419-6588-2
003 DE-He213
005 20140220084510.0
007 cr nn 008mamaa
008 100623s2010 xxu| s |||| 0|eng d
020 _a9781441965882
_9978-1-4419-6588-2
024 7 _a10.1007/978-1-4419-6588-2
_2doi
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
082 0 4 _a621.3815
_223
100 1 _aHo, Ron.
_eeditor.
245 1 0 _aCoupled Data Communication Techniques for High-Performance and Low-Power Computing
_h[electronic resource] /
_cedited by Ron Ho, Robert Drost.
264 1 _aBoston, MA :
_bSpringer US,
_c2010.
300 _aXVI, 206p. 183 illus.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aIntegrated Circuits and Systems,
_x1558-9412 ;
_v0
505 0 _ato Coupled Data Technologies -- Overview of 3D Technologies -- Power delivery, signaling and cooling for 2D and 3D integrated systems -- Coupled Data Technologies -- Capacitive Coupled Communication -- Inductive Coupled Communications -- Use of AC Coupled Interconnect in Contactless Packaging -- Enabling Coupled Data Technologies -- Aligning chips face-to-face for dense capacitive communication -- Extending Data Coupling Technologies -- Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication -- AC Coupled Wireless Power Delivery.
520 _aDesigners of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains further increases in clock frequencies, and economic realities limit the pace of Moore's Law. Coupled data communication provides a way forward, and this book, Coupled Data Communication Techniques for High-Performance and Low-Power Computing, gives a comprehensive overview for such coupled data techniques. Coupled data communication allows chips to communicate—capacitively or inductively—over short distances between chips without solder, and fundamentally shifts the design paradigm from single-chip integration to single-package integration. This book covers the state-of-the-art in the circuits, architectures, and chip packaging for this novel chip-to-chip communication technology and showcases its potential to drive the coming decades of industry growth. Coupled Data Communication Techniques for High-Performance and Low-Power Computing should be of interest to students and designers in circuits and system architecture.
650 0 _aEngineering.
650 0 _aComputer hardware.
650 0 _aComputer engineering.
650 0 _aElectronics.
650 0 _aSystems engineering.
650 1 4 _aEngineering.
650 2 4 _aCircuits and Systems.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aElectrical Engineering.
650 2 4 _aComputer Hardware.
700 1 _aDrost, Robert.
_eeditor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781441965875
830 0 _aIntegrated Circuits and Systems,
_x1558-9412 ;
_v0
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4419-6588-2
912 _aZDB-2-ENG
999 _c110663
_d110663