000 | 03532nam a22005175i 4500 | ||
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001 | 978-1-4419-6588-2 | ||
003 | DE-He213 | ||
005 | 20140220084510.0 | ||
007 | cr nn 008mamaa | ||
008 | 100623s2010 xxu| s |||| 0|eng d | ||
020 |
_a9781441965882 _9978-1-4419-6588-2 |
||
024 | 7 |
_a10.1007/978-1-4419-6588-2 _2doi |
|
050 | 4 | _aTK7888.4 | |
072 | 7 |
_aTJFC _2bicssc |
|
072 | 7 |
_aTEC008010 _2bisacsh |
|
082 | 0 | 4 |
_a621.3815 _223 |
100 | 1 |
_aHo, Ron. _eeditor. |
|
245 | 1 | 0 |
_aCoupled Data Communication Techniques for High-Performance and Low-Power Computing _h[electronic resource] / _cedited by Ron Ho, Robert Drost. |
264 | 1 |
_aBoston, MA : _bSpringer US, _c2010. |
|
300 |
_aXVI, 206p. 183 illus. _bonline resource. |
||
336 |
_atext _btxt _2rdacontent |
||
337 |
_acomputer _bc _2rdamedia |
||
338 |
_aonline resource _bcr _2rdacarrier |
||
347 |
_atext file _bPDF _2rda |
||
490 | 1 |
_aIntegrated Circuits and Systems, _x1558-9412 ; _v0 |
|
505 | 0 | _ato Coupled Data Technologies -- Overview of 3D Technologies -- Power delivery, signaling and cooling for 2D and 3D integrated systems -- Coupled Data Technologies -- Capacitive Coupled Communication -- Inductive Coupled Communications -- Use of AC Coupled Interconnect in Contactless Packaging -- Enabling Coupled Data Technologies -- Aligning chips face-to-face for dense capacitive communication -- Extending Data Coupling Technologies -- Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication -- AC Coupled Wireless Power Delivery. | |
520 | _aDesigners of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains further increases in clock frequencies, and economic realities limit the pace of Moore's Law. Coupled data communication provides a way forward, and this book, Coupled Data Communication Techniques for High-Performance and Low-Power Computing, gives a comprehensive overview for such coupled data techniques. Coupled data communication allows chips to communicate—capacitively or inductively—over short distances between chips without solder, and fundamentally shifts the design paradigm from single-chip integration to single-package integration. This book covers the state-of-the-art in the circuits, architectures, and chip packaging for this novel chip-to-chip communication technology and showcases its potential to drive the coming decades of industry growth. Coupled Data Communication Techniques for High-Performance and Low-Power Computing should be of interest to students and designers in circuits and system architecture. | ||
650 | 0 | _aEngineering. | |
650 | 0 | _aComputer hardware. | |
650 | 0 | _aComputer engineering. | |
650 | 0 | _aElectronics. | |
650 | 0 | _aSystems engineering. | |
650 | 1 | 4 | _aEngineering. |
650 | 2 | 4 | _aCircuits and Systems. |
650 | 2 | 4 | _aElectronics and Microelectronics, Instrumentation. |
650 | 2 | 4 | _aElectrical Engineering. |
650 | 2 | 4 | _aComputer Hardware. |
700 | 1 |
_aDrost, Robert. _eeditor. |
|
710 | 2 | _aSpringerLink (Online service) | |
773 | 0 | _tSpringer eBooks | |
776 | 0 | 8 |
_iPrinted edition: _z9781441965875 |
830 | 0 |
_aIntegrated Circuits and Systems, _x1558-9412 ; _v0 |
|
856 | 4 | 0 | _uhttp://dx.doi.org/10.1007/978-1-4419-6588-2 |
912 | _aZDB-2-ENG | ||
999 |
_c110663 _d110663 |