000 03602nam a22005055i 4500
001 978-1-4419-0984-8
003 DE-He213
005 20140220084504.0
007 cr nn 008mamaa
008 100301s2010 xxu| s |||| 0|eng d
020 _a9781441909848
_9978-1-4419-0984-8
024 7 _a10.1007/978-1-4419-0984-8
_2doi
050 4 _aTK7800-8360
050 4 _aTK7874-7874.9
072 7 _aTJF
_2bicssc
072 7 _aTEC008000
_2bisacsh
072 7 _aTEC008070
_2bisacsh
082 0 4 _a621.381
_223
100 1 _aKuang, Ken.
_eeditor.
245 1 0 _aRF and Microwave Microelectronics Packaging
_h[electronic resource] /
_cedited by Ken Kuang, Franklin Kim, Sean S. Cahill.
264 1 _aBoston, MA :
_bSpringer US,
_c2010.
300 _aXVI, 285 p.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aFundamentals of Packaging at Microwave and Millimeter-Wave Frequencies -- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages -- Polymeric Microelectromechanical Millimeter Wave Systems -- Millimeter-Wave Chip-on-Board Integration and Packaging -- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules -- RF/Microwave Substrate Packaging Roadmap for Portable Devices -- Ceramic Systems in Package for RF and Microwave -- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications -- LTCC Substrates for RF/MW Application -- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging -- High Performance Microelectronics Packaging Heat Sink Materials -- Technology Research on AlN 3D MCM.
520 _aRF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices.
650 0 _aEngineering.
650 0 _aMicrowaves.
650 0 _aElectronics.
650 0 _aSystems engineering.
650 1 4 _aEngineering.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aMicrowaves, RF and Optical Engineering.
650 2 4 _aCircuits and Systems.
700 1 _aKim, Franklin.
_eeditor.
700 1 _aCahill, Sean S.
_eeditor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781441909831
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4419-0984-8
912 _aZDB-2-ENG
999 _c110290
_d110290