000			03213nam a22005415i 4500
001			978-1-4419-0784-4
003			DE-He213
005			20140220084503.0
007			cr nn 008mamaa
008			100301s2010 xxu| s |||| 0|eng d
020			_a9781441907844 _9978-1-4419-0784-4
024	7		_a10.1007/978-1-4419-0784-4 _2doi
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
072		7	_aTEC008070 _2bisacsh
082	0	4	_a621.381 _223
100	1		_aXie, Yuan. _eeditor.
245	1	0	_aThree Dimensional Integrated Circuit Design _h[electronic resource] : _bEDA, Design and Microarchitectures / _cedited by Yuan Xie, Jason Cong, Sachin Sapatnekar.
264		1	_aBoston, MA : _bSpringer US, _c2010.
300			_bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
490	1		_aIntegrated Circuits and Systems, _x1558-9412
505	0		_a3D Process Technology Considerations -- Thermal and Power Delivery Challenges in 3D ICs -- Thermal-Aware 3D Floorplan -- Thermal-Aware 3D Placement -- Thermal Via Insertion and Thermally Aware Routing in 3D ICs -- Three-Dimensional Microprocessor Design -- Three-Dimensional Network-on-Chip Architecture -- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers -- System-Level 3D IC Cost Analysis and Design Exploration.
520			_aThis book presents an overview of the field of 3D IC design, with an emphasis on electronic design automation (EDA) tools and algorithms that can enable the adoption of 3D ICs, and the architectural implementation and potential for future 3D system design. The aim of this book is to provide the reader with a complete understanding of: the promise of 3D ICs in building novel systems that enable the chip industry to continue along the path of performance scaling, the state of the art in fabrication technologies for 3D integration, the most prominent 3D-specific EDA challenges, along with solutions and best practices, the architectural benefits of using 3D technology, architectural-and system-level design issues, and the cost implications of 3D IC design. Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design.
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aOptical materials.
650		0	_aSurfaces (Physics).
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aSurfaces and Interfaces, Thin Films.
650	2	4	_aEngineering, general.
700	1		_aCong, Jason. _eeditor.
700	1		_aSapatnekar, Sachin. _eeditor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781441907837
830		0	_aIntegrated Circuits and Systems, _x1558-9412
856	4	0	_uhttp://dx.doi.org/10.1007/978-1-4419-0784-4
912			_aZDB-2-ENG
999			_c110253 _d110253