000			03501nam a22005535i 4500
001			978-0-387-88783-8
003			DE-He213
005			20140220084456.0
007			cr nn 008mamaa
008			100715s2010 xxu| s |||| 0|eng d
020			_a9780387887838 _9978-0-387-88783-8
024	7		_a10.1007/978-0-387-88783-8 _2doi
050		4	_aTK7800-8360
050		4	_aTK7874-7874.9
072		7	_aTJF _2bicssc
072		7	_aTEC008000 _2bisacsh
072		7	_aTEC008070 _2bisacsh
082	0	4	_a621.381 _223
100	1		_aLi, Yi. _eauthor.
245	1	0	_aElectrical Conductive Adhesives with Nanotechnologies _h[electronic resource] / _cby Yi Li, Daniel Lu, C. P. Wong.
264		1	_aBoston, MA : _bSpringer US, _c2010.
300			_bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
505	0		_aNanotechnology -- Characterizations of Electrically Conductive Adhesives -- Isotropically Conductive Adhesives (ICAs) -- Anisotropically Conductive Adhesives/Films (ACA/ACF) -- Non-Conductive Adhesives/Films (NCA/NCF) -- Conductive Nano-Inks -- Intrinsically Conducting Polymers (ICPs) -- Future Trend of Conductive Adhesive Technology.
520			_aElectrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic packaging, discussing the various electrical adhesive options currently available. The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors also present examples of how conductive adhesives can be applied to nano techniques, while making important mentions of recent research and development breakthroughs in the fields. Drawing upon tireless research, years of theoretical development and practical experience, and utilizing numerous visual examples and illustrative applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives in depth, while also describing: The electrical properties, thermal performance, bonding pressure, assembly and reliability of numerous types of electrically conductive adhesives The similarities and differences between lead-free soldering techniques and electrically conductive adhesives, while also discussing the advantages of ECAs. Insights into the future of nano ECAs, as well as projections of future industry trends. Electrical Conductive Adhesives with Nanotechnologies is a must-read for both researchers and active engineers in the electronic packaging field.
650		0	_aEngineering.
650		0	_aElectronics.
650		0	_aSystems engineering.
650		0	_aMaterials.
650		0	_aOptical materials.
650		0	_aNanotechnology.
650	1	4	_aEngineering.
650	2	4	_aElectronics and Microelectronics, Instrumentation.
650	2	4	_aNanotechnology.
650	2	4	_aCircuits and Systems.
650	2	4	_aOptical and Electronic Materials.
650	2	4	_aMaterials Science, general.
700	1		_aLu, Daniel. _eauthor.
700	1		_aWong, C. P. _eauthor.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9780387887821
856	4	0	_uhttp://dx.doi.org/10.1007/978-0-387-88783-8
912			_aZDB-2-ENG
999			_c109850 _d109850