000 04478nam a22005535i 4500
001 978-0-387-47318-5
003 DE-He213
005 20140220083710.0
007 cr nn 008mamaa
008 110317s2011 xxu| s |||| 0|eng d
020 _a9780387473185
_9978-0-387-47318-5
024 7 _a10.1007/978-0-387-47318-5
_2doi
050 4 _aTK7800-8360
050 4 _aTK7874-7874.9
072 7 _aTJF
_2bicssc
072 7 _aTEC008000
_2bisacsh
072 7 _aTEC008070
_2bisacsh
082 0 4 _a621.381
_223
100 1 _aGhodssi, Reza.
_eeditor.
245 1 0 _aMEMS Materials and Processes Handbook
_h[electronic resource] /
_cedited by Reza Ghodssi, Pinyen Lin.
246 3 _aThe Handbook MEMs Materials and Processes offers a much more detailed treatment than the book by Leondes which is more general in its coverage and certainly less applied
264 1 _aBoston, MA :
_bSpringer US :
_bImprint: Springer,
_c2011.
300 _aXXXVI, 1188 p. 200 illus.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
490 1 _aMEMS Reference Shelf,
_x1936-4407 ;
_v1
505 0 _aIntroduction – Reza Ghodssi and Pinyen Lin -- The MEMS Design Process – Tina Lamers and Beth Pruitt -- Additive Processes for Semiconductors and Dielectric Materials – Chris Zorman, Robert C. Roberts and Li Chen -- Additive Processes for Metals – David Arnold, Monika Saumer and Yong Kyu-Yoon -- Additive Processes for Polymeric Materials – Ellis Meng, Xin Zhang, and William Benard -- Additive Processes for Piezoelectric Materials – Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga -- Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga -- Dry Etching for Micromachining Applications – Srinivas Tadigadapa and Franz Laermer -- MEMS Wet-Etch Processes and Procedures – David Burns -- MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi -- Doping - Alan D. Raisanen -- Wafer Bonding – Shawn Cunningham and Mario Kupnik -- MEMS Packaging Materials – Ann Garrison Darrin and Robert Osiander -- Surface Treatment and Planarization – Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan -- MEMS Process Integration – Michael Huff, Stephen Bart, and Pinyen Lin.              .
520 _aMEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive 'Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate materials for the required task at hand. The 'Processes' section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs. The book also: Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS Discusses specific MEMS fabrication techniques such as additive, subtractive, and lithography/patterning, as well as wafer bonding, doping, surface treatment/preparation, and characterization techniques Provides the reader with a quick check list of the advantage/disadvantage of fabrication MEMS Material and Processes Handbook will be a valuable book for researchers, engineers and students working in MEMS and materials processing.           
650 0 _aEngineering.
650 0 _aElectronics.
650 0 _aSystems engineering.
650 0 _aMaterials.
650 0 _aSurfaces (Physics).
650 1 4 _aEngineering.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aMaterials Science, general.
650 2 4 _aCircuits and Systems.
650 2 4 _aSurfaces and Interfaces, Thin Films.
700 1 _aLin, Pinyen.
_eeditor.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9780387473161
830 0 _aMEMS Reference Shelf,
_x1936-4407 ;
_v1
856 4 0 _uhttp://dx.doi.org/10.1007/978-0-387-47318-5
912 _aZDB-2-ENG
999 _c105022
_d105022