000 03149nam a22004575i 4500
001 978-1-4614-0103-2
003 DE-He213
005 20140220083238.0
007 cr nn 008mamaa
008 120516s2012 xxu| s |||| 0|eng d
020 _a9781461401032
_9978-1-4614-0103-2
024 7 _a10.1007/978-1-4614-0103-2
_2doi
050 4 _aTK7888.4
072 7 _aTJFC
_2bicssc
072 7 _aTEC008010
_2bisacsh
082 0 4 _a621.3815
_223
100 1 _aSchwaderer, W David.
_eauthor.
245 1 0 _aIntroduction to Open Core Protocol
_h[electronic resource] :
_bFastpath to System-on-Chip Design /
_cby W David Schwaderer.
264 1 _aNew York, NY :
_bSpringer New York :
_bImprint: Springer,
_c2012.
300 _aXV, 165 p. 57 illus.
_bonline resource.
336 _atext
_btxt
_2rdacontent
337 _acomputer
_bc
_2rdamedia
338 _aonline resource
_bcr
_2rdacarrier
347 _atext file
_bPDF
_2rda
505 0 _aIn the Beginning...There Were No Standards -- OCP Training Wheels -- OCP Write Operations -- OCP Signals and Signal Groupings -- Basic Signal Burst Extensions -- Read Timing Diagrams -- OCP Tags, Threads, and Connections -- OCP Signal Groups and Phases -- OCP Coherence Extensions: Theory of Operation -- OCP Coherence Extensions: Signals and Encodings -- OCP Coherence Extensions Timing Diagrams -- OCP-IP Debug Interfaces -- Benchmarking Network-on-Chip (NoC) Designs.
520 _aThis book introduces Open Core Protocol (OCP), not as a conventional hardware communications protocol but as a meta-protocol: a means for describing and capturing the communications requirements of an IP core, and mapping them to a specific set of signals with known semantics.  Readers will learn the capabilities of OCP as a semiconductor hardware interface specification that allows different System-On-Chip (SoC) cores to communicate.  The OCP methodology presented enables intellectual property designers to design core interfaces in standard ways. This facilitates reusing OCP-compliant cores across multiple SoC designs which, in turn, drastically reduces design times, support costs, and overall cost for electronics/SoCs. Provides a comprehensive introduction to Open Core Protocol, which is more accessible than the full specification; Designed as a hands-on, how-to guide to semiconductor design; Includes numerous, real “usage examples” which are not available in the full specification; Integrates coverage of design methodology discussing why cores are structured the way they are, whereas the official OCP specification only answers what the structure is.
650 0 _aEngineering.
650 0 _aComputer science.
650 0 _aElectronics.
650 0 _aSystems engineering.
650 1 4 _aEngineering.
650 2 4 _aCircuits and Systems.
650 2 4 _aElectronics and Microelectronics, Instrumentation.
650 2 4 _aProcessor Architectures.
710 2 _aSpringerLink (Online service)
773 0 _tSpringer eBooks
776 0 8 _iPrinted edition:
_z9781461401025
856 4 0 _uhttp://dx.doi.org/10.1007/978-1-4614-0103-2
912 _aZDB-2-ENG
999 _c100803
_d100803