Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban.
By: Dziuban, Jan A.
Contributor(s): SpringerLink (Online service).
Material type: BookSeries: Springer Series in Advanced Microelectronics, 24.Publisher: Dordrecht : Springer Netherlands, 2006Description: digital.ISBN: 9781402045899.Subject(s): Engineering | Materials | Structural control (Engineering) | Electronics | Optical materials | Engineering | Continuum Mechanics and Mechanics of Materials | Physics and Applied Physics in Engineering | Optical and Electronic Materials | Electronics and Microelectronics, Instrumentation | Operating Procedures, Materials TreatmentDDC classification: 620.1 Online resources: Click here to access online In: Springer eBooksNo physical items for this record
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