Solder Joint Reliability Prediction for Multiple Environments [electronic resource] / by Andrew E. Perkins, Suresh K. Sitaraman.
By: Perkins, Andrew E.
Contributor(s): Sitaraman, Suresh K | SpringerLink (Online service).
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BookPublisher: Boston, MA : Springer US, 2009Description: digital.ISBN: 9780387793948.Subject(s): Engineering | System safety | Electronics | Optical materials | Materials | Engineering | Electronics and Microelectronics, Instrumentation | Metallic Materials | Optical and Electronic Materials | Quality Control, Reliability, Safety and RiskOnline resources: Click here to access online
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