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Integrated Circuit Packaging, Assembly and Interconnections [electronic resource] / by William J. Greig.

By: Greig, William J.
Contributor(s): SpringerLink (Online service).
Material type: materialTypeLabelBookPublisher: Boston, MA : Springer US, 2007Description: digital.ISBN: 9780387339139.Subject(s): Engineering | Engineering design | Electronics | Systems engineering | Optical materials | Engineering | Electronics and Microelectronics, Instrumentation | Circuits and Systems | Engineering Design | Optical and Electronic MaterialsDDC classification: 621.381 Online resources: Click here to access online In: Springer eBooks
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