Avoiding inelastic strains in solder joint interconnections of IC devices / authored by: Ephraim Suhir.
By: Suhir, Ephraim [author.].
Material type:
BookPublisher: Boca Raton, FL : CRC Press, 2020Edition: First edition.Description: 1 online resource : illustrations.Content type: text Media type: computer Carrier type: online resourceISBN: 9780429460470; 0429460473; 9780429863820; 0429863829; 9780429863813; 0429863810; 9780429863806; 0429863802.Subject(s): Interconnects (Integrated circuit technology) -- Protection | Solder and soldering -- Mechanical properties -- Mathematical models | Failure analysis (Engineering) | TECHNOLOGY / Electronics / General | TECHNOLOGY / Material Science | Electronic booksDDC classification: 621.3815 Online resources: Taylor & Francis | OCLC metadata license agreement Summary: "The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"-- Provided by publisher.
"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"-- Provided by publisher.
OCLC-licensed vendor bibliographic record.
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