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Built-in-Self-Test and Digital Self-Calibration for RF SoCs [electronic resource] / by Sleiman Bou-Sleiman, Mohammed Ismail.

By: Bou-Sleiman, Sleiman [author.].
Contributor(s): Ismail, Mohammed [author.] | SpringerLink (Online service).
Material type: materialTypeLabelBookSeries: SpringerBriefs in Electrical and Computer Engineering: Publisher: New York, NY : Springer New York, 2012Description: XVII, 89p. 70 illus. online resource.Content type: text Media type: computer Carrier type: online resourceISBN: 9781441995483.Subject(s): Engineering | Systems engineering | Engineering | Circuits and Systems | Signal, Image and Speech Processing | Electronic Circuits and DevicesDDC classification: 621.3815 Online resources: Click here to access online
Contents:
Introduction and Motivation -- Radio Systems Overview: Architecture, Performance and Built-in-Test -- Efficient Testing for RF SoCs -- RF Built-in-Self-Test -- RF Built-in-Self-Calibration -- Conclusions.
In: Springer eBooksSummary: This book will introduce design methodologies, known as Built-in-Self-Test (BiST) and Built-in-Self-Calibration (BiSC), which enhance the robustness of radio frequency (RF) and millimeter wave (mmWave) integrated circuits (ICs). These circuits are used in current and emerging communication, computing, multimedia and biomedical products and microchips. The design methodologies presented will result in enhancing the yield (percentage of working chips in a high volume run) of RF and mmWave ICs which will enable successful manufacturing of such microchips in high volume. 
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Introduction and Motivation -- Radio Systems Overview: Architecture, Performance and Built-in-Test -- Efficient Testing for RF SoCs -- RF Built-in-Self-Test -- RF Built-in-Self-Calibration -- Conclusions.

This book will introduce design methodologies, known as Built-in-Self-Test (BiST) and Built-in-Self-Calibration (BiSC), which enhance the robustness of radio frequency (RF) and millimeter wave (mmWave) integrated circuits (ICs). These circuits are used in current and emerging communication, computing, multimedia and biomedical products and microchips. The design methodologies presented will result in enhancing the yield (percentage of working chips in a high volume run) of RF and mmWave ICs which will enable successful manufacturing of such microchips in high volume. 

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