The Art of Software Thermal Management for Embedded Systems (Record no. 92418)
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000 -LEADER | |
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fixed length control field | 03324nam a22004695i 4500 |
001 - CONTROL NUMBER | |
control field | 978-1-4939-0298-9 |
003 - CONTROL NUMBER IDENTIFIER | |
control field | DE-He213 |
005 - DATE AND TIME OF LATEST TRANSACTION | |
control field | 20140220082506.0 |
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
fixed length control field | cr nn 008mamaa |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 140103s2014 xxu| s |||| 0|eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
International Standard Book Number | 9781493902989 |
-- | 978-1-4939-0298-9 |
024 7# - OTHER STANDARD IDENTIFIER | |
Standard number or code | 10.1007/978-1-4939-0298-9 |
Source of number or code | doi |
050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
Classification number | TK7888.4 |
072 #7 - SUBJECT CATEGORY CODE | |
Subject category code | TJFC |
Source | bicssc |
072 #7 - SUBJECT CATEGORY CODE | |
Subject category code | TEC008010 |
Source | bisacsh |
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 621.3815 |
Edition number | 23 |
100 1# - MAIN ENTRY--PERSONAL NAME | |
Personal name | Benson, Mark. |
Relator term | author. |
245 14 - TITLE STATEMENT | |
Title | The Art of Software Thermal Management for Embedded Systems |
Medium | [electronic resource] / |
Statement of responsibility, etc | by Mark Benson. |
264 #1 - | |
-- | New York, NY : |
-- | Springer New York : |
-- | Imprint: Springer, |
-- | 2014. |
300 ## - PHYSICAL DESCRIPTION | |
Extent | XVI, 124 p. 51 illus., 2 illus. in color. |
Other physical details | online resource. |
336 ## - | |
-- | text |
-- | txt |
-- | rdacontent |
337 ## - | |
-- | computer |
-- | c |
-- | rdamedia |
338 ## - | |
-- | online resource |
-- | cr |
-- | rdacarrier |
347 ## - | |
-- | text file |
-- | |
-- | rda |
505 0# - FORMATTED CONTENTS NOTE | |
Formatted contents note | Introduction to Software Thermal Management -- Landscape: History, Present Barriers and The Road Forward -- Roots: a Bedrock of Giants -- Techniques: Putting the Silicon to Work -- Frameworks: Choreographing the Parts -- Frontiers: The Future of Software Thermal Management. |
520 ## - SUMMARY, ETC. | |
Summary, etc | This book introduces Software Thermal Management (STM) as a means of reducing power consumption in a computing system, in order to manage heat, improve component reliability, and increase system safety. Readers will benefit from this pragmatic guide to the field of STM for embedded systems and its catalog of software power management techniques. Since thermal management is a key bottleneck in embedded systems design, this book focuses on power as the root cause of heat. Since software has an enormous impact on power consumption in an embedded system, this book guides readers to manage heat effectively by understanding, categorizing, and developing new ways to reduce dynamic power. Whereas most books on thermal management describe mechanisms to remove heat, this book focuses on ways to avoid generating heat in the first place. • Explains fundamentals of software thermal management, application techniques and advanced optimization strategies; • Describes a novel method for managing dynamic power, enabling designers to extend component life for battery-powered devices that must be operational and reliable for 10+ years; • Focuses on power management as a way to manage heat and provides a catalog of pragmatic approaches to manage power in actual products, depending on the type of device and the goals of the design; • Uses summaries throughout the text to reinforce key concepts when introduced; • Includes case studies that demonstrate key concepts introduced. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Engineering. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Software engineering. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Electronics. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Systems engineering. |
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Engineering. |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Circuits and Systems. |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Electronics and Microelectronics, Instrumentation. |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Software Engineering. |
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Energy Efficiency (incl. Buildings). |
710 2# - ADDED ENTRY--CORPORATE NAME | |
Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
773 0# - HOST ITEM ENTRY | |
Title | Springer eBooks |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
Display text | Printed edition: |
International Standard Book Number | 9781493902972 |
856 40 - ELECTRONIC LOCATION AND ACCESS | |
Uniform Resource Identifier | http://dx.doi.org/10.1007/978-1-4939-0298-9 |
912 ## - | |
-- | ZDB-2-ENG |
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