RF and Microwave Microelectronics Packaging (Record no. 110290)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03602nam a22005055i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-1-4419-0984-8 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20140220084504.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 100301s2010 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781441909848 |
| -- | 978-1-4419-0984-8 |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1007/978-1-4419-0984-8 |
| Source of number or code | doi |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7800-8360 |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7874-7874.9 |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TJF |
| Source | bicssc |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC008000 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC008070 |
| Source | bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381 |
| Edition number | 23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Kuang, Ken. |
| Relator term | editor. |
| 245 10 - TITLE STATEMENT | |
| Title | RF and Microwave Microelectronics Packaging |
| Medium | [electronic resource] / |
| Statement of responsibility, etc | edited by Ken Kuang, Franklin Kim, Sean S. Cahill. |
| 264 #1 - | |
| -- | Boston, MA : |
| -- | Springer US, |
| -- | 2010. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | XVI, 285 p. |
| Other physical details | online resource. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies -- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages -- Polymeric Microelectromechanical Millimeter Wave Systems -- Millimeter-Wave Chip-on-Board Integration and Packaging -- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules -- RF/Microwave Substrate Packaging Roadmap for Portable Devices -- Ceramic Systems in Package for RF and Microwave -- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications -- LTCC Substrates for RF/MW Application -- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging -- High Performance Microelectronics Packaging Heat Sink Materials -- Technology Research on AlN 3D MCM. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also: Presents methods and techniques used for measuring and testing of the electronic materials properties. Engages in an in-depth discussion of ceramic materials for RF/MW packaging. Offers numerical simulation methods and techniques used in analysis of electronic devices and materials. Discusses thermal management issues for RF/MW packaging. Creates a RF/Microwave Packaging Roadmap for Portable Devices. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Microwaves. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Systems engineering. |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Microwaves, RF and Optical Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Circuits and Systems. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Kim, Franklin. |
| Relator term | editor. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Cahill, Sean S. |
| Relator term | editor. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY | |
| Title | Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Display text | Printed edition: |
| International Standard Book Number | 9781441909831 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-1-4419-0984-8 |
| 912 ## - | |
| -- | ZDB-2-ENG |
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