MEMS Materials and Processes Handbook (Record no. 105022)
[ view plain ]
| 000 -LEADER | |
|---|---|
| fixed length control field | 04478nam a22005535i 4500 |
| 001 - CONTROL NUMBER | |
| control field | 978-0-387-47318-5 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | DE-He213 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20140220083710.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 110317s2011 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780387473185 |
| -- | 978-0-387-47318-5 |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1007/978-0-387-47318-5 |
| Source of number or code | doi |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7800-8360 |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7874-7874.9 |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TJF |
| Source | bicssc |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC008000 |
| Source | bisacsh |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC008070 |
| Source | bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381 |
| Edition number | 23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Ghodssi, Reza. |
| Relator term | editor. |
| 245 10 - TITLE STATEMENT | |
| Title | MEMS Materials and Processes Handbook |
| Medium | [electronic resource] / |
| Statement of responsibility, etc | edited by Reza Ghodssi, Pinyen Lin. |
| 246 3# - VARYING FORM OF TITLE | |
| Title proper/short title | The Handbook MEMs Materials and Processes offers a much more detailed treatment than the book by Leondes which is more general in its coverage and certainly less applied |
| 264 #1 - | |
| -- | Boston, MA : |
| -- | Springer US : |
| -- | Imprint: Springer, |
| -- | 2011. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | XXXVI, 1188 p. 200 illus. |
| Other physical details | online resource. |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 347 ## - | |
| -- | text file |
| -- | |
| -- | rda |
| 490 1# - SERIES STATEMENT | |
| Series statement | MEMS Reference Shelf, |
| International Standard Serial Number | 1936-4407 ; |
| Volume number/sequential designation | 1 |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Introduction – Reza Ghodssi and Pinyen Lin -- The MEMS Design Process – Tina Lamers and Beth Pruitt -- Additive Processes for Semiconductors and Dielectric Materials – Chris Zorman, Robert C. Roberts and Li Chen -- Additive Processes for Metals – David Arnold, Monika Saumer and Yong Kyu-Yoon -- Additive Processes for Polymeric Materials – Ellis Meng, Xin Zhang, and William Benard -- Additive Processes for Piezoelectric Materials – Ronald Polcawich, Jeff Pulskamp, Takashi Mineta, and Yoichi Haga -- Materials and Processes in Shape-Memory Alloy - Takashi Mineta and Yoichi Haga -- Dry Etching for Micromachining Applications – Srinivas Tadigadapa and Franz Laermer -- MEMS Wet-Etch Processes and Procedures – David Burns -- MEMS Lithography and Micromachining Techniques - Daniel Hines, Nathan Siwak, Lance Mosher and Reza Ghodssi -- Doping - Alan D. Raisanen -- Wafer Bonding – Shawn Cunningham and Mario Kupnik -- MEMS Packaging Materials – Ann Garrison Darrin and Robert Osiander -- Surface Treatment and Planarization – Pinyen Lin, Roya Maboudian, Carlo Carraro, Fan-Gang Tseng, Pen-Cheng Wang, and Yongqing Lan -- MEMS Process Integration – Michael Huff, Stephen Bart, and Pinyen Lin. . |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc | MEMS Materials and Processes Handbook is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on 'Materials' and 'Processes'. The extensive 'Material Selection Guide' and a 'Material Database' guides the reader through the selection of appropriate materials for the required task at hand. The 'Processes' section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs. The book also: Provides a comprehensive catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMS Discusses specific MEMS fabrication techniques such as additive, subtractive, and lithography/patterning, as well as wafer bonding, doping, surface treatment/preparation, and characterization techniques Provides the reader with a quick check list of the advantage/disadvantage of fabrication MEMS Material and Processes Handbook will be a valuable book for researchers, engineers and students working in MEMS and materials processing. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Systems engineering. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Materials. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Surfaces (Physics). |
| 650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Electronics and Microelectronics, Instrumentation. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Materials Science, general. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Circuits and Systems. |
| 650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Surfaces and Interfaces, Thin Films. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Lin, Pinyen. |
| Relator term | editor. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY | |
| Title | Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Display text | Printed edition: |
| International Standard Book Number | 9780387473161 |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| Uniform title | MEMS Reference Shelf, |
| -- | 1936-4407 ; |
| Volume number/sequential designation | 1 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | http://dx.doi.org/10.1007/978-0-387-47318-5 |
| 912 ## - | |
| -- | ZDB-2-ENG |
No items available.