Zschech, Ehrenfried.
Materials for Information Technology Devices, Interconnects and Packaging / [electronic resource] : edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick. - London : Springer London, 2005. - digital. - Engineering Materials and Processes, 1619-0181 . - Engineering Materials and Processes, .
9781846282355
10.1007/1-84628-235-7 doi
Engineering.
Particles (Nuclear physics).
Electronics.
Materials.
Surfaces (Physics).
Engineering.
Physics and Applied Physics in Engineering.
Electronics and Microelectronics, Instrumentation.
Solid State Physics and Spectroscopy.
Ceramics, Glass, Composites, Natural Methods.
Surfaces and Interfaces, Thin Films.
Metallic Materials.
Materials for Information Technology Devices, Interconnects and Packaging / [electronic resource] : edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick. - London : Springer London, 2005. - digital. - Engineering Materials and Processes, 1619-0181 . - Engineering Materials and Processes, .
9781846282355
10.1007/1-84628-235-7 doi
Engineering.
Particles (Nuclear physics).
Electronics.
Materials.
Surfaces (Physics).
Engineering.
Physics and Applied Physics in Engineering.
Electronics and Microelectronics, Instrumentation.
Solid State Physics and Spectroscopy.
Ceramics, Glass, Composites, Natural Methods.
Surfaces and Interfaces, Thin Films.
Metallic Materials.